Quality - Laboratory Scope

 
Section
Equipment
Use
Standard
3.1 Thickness Testing
X-ray Fluorescence Testers
Test thickness of Tin, Tin / Lead and Nickel plating.
Reference ASTM B568
Kocour Thickness
Test thickness of Copper plating
Reference ASTM B504
3.2 Solderability Testing
Solder Pot
Determine the solderability of Tin and Tin / Lead plating
Reference ASTM B545
3.3 Steam Age Testing
Steam Vessel and Heating Unit
Determine the solderability of Tin and Tin / Lead plating
Mil. Std 202F.
ANSI 002A,
ASTM B579-73,
Siemens Spec. 14N0345
3.4 Adhesion Testing
Use bend test, scribe / grid test, or burnishing test to determine the quality of a plating finish
ASTM B571-97
3.5 Plating Bath Analysis
Titration equipment, Hull Cell
Determine the metal and acid levels of various baths in order to maintain plating quality
Metal Finishing
Guidebook,
Manufacturer Specifications
3.6 Temperature Measurement
Thermometers
Monitoring the temperature of the solder pot as well as various plating baths
NIST Special Publication 819
3.7 Reflectivity
Gardner Tri-Gloss Meter
Determine the reflectivity/gloass of various finishes
Metal Finishing Guidebook
3.8 Waste Water Quality Measurement
Hach DR3000 Spectrophotometer; Varian Atomic Absorption Spectrophotometer
Determine levels of Copper and Nickel in waste water
USEPA method 8506 & 8150
3.9 Oven Testing
Blue M Laboratory Oven
Determine the effects of high temperatures on various finishes
Metal Finishing Guidebook
3.10 PH Measurement
PH Meters
Determine the pH of various plating baths to maintain plating quality
Metal Finishing Guidebook
3.11 Surface Roughness
Hommel Model T1000 Surface Roughness Gauge
Check surface roughness of customer base material and finished plated surfaces
ISO 4287:1997

Selective Plating, Inc.
240 South Lombard Rd.
Addison, IL  60101
Ph: 630.543.1380   Fax: 630.543.1392