Section |
Equipment |
Use |
Standard |
3.1 Thickness Testing |
X-ray Fluorescence Testers |
Test thickness of Tin, Tin / Lead and Nickel plating. |
Reference ASTM B568 |
|
Kocour Thickness |
Test thickness of Copper plating |
Reference ASTM B504 |
3.2 Solderability Testing |
Solder Pot |
Determine the solderability of Tin and Tin / Lead plating |
Reference ASTM B545 |
3.3 Steam Age Testing |
Steam Vessel and Heating Unit |
Determine the solderability of Tin and Tin / Lead plating |
Mil. Std 202F.
ANSI 002A,
ASTM B579-73,
Siemens Spec. 14N0345 |
3.4 Adhesion Testing |
|
Use bend test, scribe / grid test, or burnishing test to determine the quality of a plating finish |
ASTM B571-97 |
3.5 Plating Bath Analysis |
Titration equipment, Hull Cell |
Determine the metal and acid levels of various baths in order to maintain plating quality |
Metal Finishing
Guidebook,
Manufacturer Specifications |
3.6 Temperature Measurement |
Thermometers |
Monitoring the temperature of the solder pot as well as various plating baths |
NIST Special Publication 819 |
3.7 Reflectivity |
Gardner Tri-Gloss Meter |
Determine the reflectivity/gloass of various finishes |
Metal Finishing Guidebook |
3.8 Waste Water Quality Measurement |
Hach DR3000 Spectrophotometer; Varian Atomic Absorption Spectrophotometer |
Determine levels of Copper and Nickel in waste water |
USEPA method 8506 & 8150 |
3.9 Oven Testing |
Blue M Laboratory Oven |
Determine the effects of high temperatures on various finishes |
Metal Finishing Guidebook |
3.10 PH Measurement |
PH Meters |
Determine the pH of various plating baths to maintain plating quality |
Metal Finishing Guidebook |
3.11 Surface Roughness |
Hommel Model T1000 Surface Roughness Gauge |
Check surface roughness of customer base material and finished plated surfaces |
ISO 4287:1997 |
Quality - Laboratory Scope
