Section |
Equipment |
Use |
Standard |
3.1 Thickness Testing |
X-ray Fluorescence Testers |
Determine thickness and content of plated surfaces. |
Reference ASTM B568 |
|
Coulometric Thickness Tester |
Determine thicknessof plated surfaces. |
Reference ASTM B504 |
3.2 Solderability Testing |
Solder Pot |
Determine the solderability of Tin plating |
Reference ASTM B545 |
3.3 Steam Age Testing |
Steam Vessel and Heating Unit |
Determine the solderability of Tin plating |
Mil. Std 202F.
ANSI 002A,
ASTM B579-73,
Siemens Spec. 14N0345 |
3.4 Adhesion Testing |
Hand Tools |
Use bend test, scribe / grid test, or burnishing test to determine the quality of a plating finish |
ASTM B571-97 |
3.5 Plating Bath Analysis |
Titration equipment, Hull Cell |
Determine the levels of various bath components to maintain process control. |
Metal Finishing
Guidebook,
Manufacturer Specifications |
3.6 Temperature Measurement |
Thermometers |
Monitoring the temperature of the solder pot as well as various plating baths |
NIST Special Publication 819 |
3.7 Reflectivity |
Gloss Meter |
Determine the reflectivity/gloss of various finishes |
Metal Finishing Guidebook |
3.8 Waste Water Quality Measurement |
Spectrophotometer |
Determine levels of regulated substances within discharged waste water. |
USEPA method 8506 & 8150 |
3.9 Oven Testing |
Convection and IR Reflow ovens |
Determine the effects of high temperatures on various finishes |
ASTM B545 |
3.10 PH Measurement |
PH Meters |
Determine the pH of various plating baths to maintain plating quality |
ASTM E70 |
3.11 Surface Roughness |
Profilometer |
Check surface roughness of customer base material and finished plated surfaces |
ISO 4287:1997 |
Quality - Laboratory Scope
